Photonic Packaging Engineer, Principal

We are seeking a visionary and technically strong Photonic Packaging Engineer, Principal to lead the design, development, and productization of advanced packaging solutions for advanced optics. This role will drive the intersection of photonics, high-speed electronics, thermal management, and mechanical integration to enable next-generation data center and networking platforms.

You will guide a multidisciplinary team through all phases of product realization—from concept and design through manufacturing scale-up—working closely with silicon photonics, electrical packaging, systems, and supply chain teams to achieve world-class optical and electrical performance.

Key Responsibilities

• Lead the end-to-end development of photonic packaging strategies for Silicon Photonics Modules, including EIC/PIC co-packaging, optical coupling, fiber attach, and thermal and mechanical design.

• Define technical requirements and package architectures that balance performance, manufacturability, and cost with compatibility with established electronic packaging flows.

• Collaborate with IC packaging, optical connector, and silicon photonics teams to achieve co-design optimization

• Build and mentor a high-performing team of packaging engineers and scientists.

• Drive supplier engagement and technology partnerships for packaging partnerships and innovations.

• Oversee failure analysis, reliability testing, and yield improvement efforts.

• Contribute to the long-term package technology roadmap for advanced optical integration and scalability with ALAB's signal connectivity portfolio.

Qualifications

• Ph.D. or M.S. in Electrical Engineering, Physics, Materials Science, Mechanical Engineering, or related field.

• 10+ years of experience in photonic packaging, optical transceivers, or advanced semiconductor packaging.

• Proven expertise in high-speed optical/electrical packaging, thermal management, and precision optomechanical design.

• Deep understanding of optoelectronic package integration

• Track record of leading complex hardware from R&D through high-volume manufacturing.

• Strong program management and cross-functional leadership skills.

• Excellent communication, negotiation, and organizational abilities.

Preferred Experience

• Experience with silicon photonics integrated devices

• Familiarity with advanced packaging optics trends and data center network architectures.

• Background in contract manufacturing, vendor qualification, and global supply chain management.