Principal Member of Technical Staff, LCM Advanced Packaging & Manufacturing Engineer

Lumotive is pioneering the era of programmable optics—where light is controlled as intelligently and flexibly as software.   At the heart of this transformation is a once-in-a-generation innovation: a flat CMOS-based “general purpose optic.” Lumotive’s Light Control Metasurface (LCM™) beam forming chips can be programmed to function as a beam steering mirror, a lens, mirror, a beam splitter—or any optical function—replacing bulky and mechanical optical components with a fully digital, reconfigurable semiconductor . This breakthrough lays the foundation for a massive shift in multiple technologies—from 3D sensing and imaging to optical networking, free space optical communication, and beyond. Like the shift from analog to digital in electronics, programmable optics will reshape industries from robotics, self-driving cars, AI, defense, and healthcare. Lumotive’s first commercial application is in LiDAR, where its software-defined beam steering chips are already enabling compact, high-performance, solid-state sensors. These sensors are being deployed today in smart infrastructure, robotics, and mobility systems through leading module makers and solution integrators. With more than 200 patents and growing commercial traction, Lumotive is delivering the world’s first digital platform for light—and redefining what’s possible in the optical age. Job Description: Lumotive is seeking a Principal Member of Technical Staff based in Taiwan with deep expertise in New Product Introduction (NPI)  and production management for semiconductor advanced packaging and test of optical devices. This is an outward-facing role that requires regular travel to key suppliers across Taiwan and China. You will serve as a critical link between design and production, executing best practices with vendors across wafer fab, OSAT, LCOS assembly, optical sub-assembly, and test, including support for Lumotive’s wafer fab partner as needed. In addition to technical leadership, this role requires strong project ownership, supplier coordination, and disciplined execution to drive schedules, milestones, and issue resolution across a distributed supply base.  The role reports to the Director, Semiconductor Module Manufacturing in the Redmond, Washington office.