SoC Hardware Architect
nxp
Full time
Wire Bond Process Assistant Engineer
nxp· TW61 NXP Semiconductors Taiwan Ltd
About this role
- 製程數據、實驗結果與量測資料之彙整、輸入及文書管理。
- 協助進行基本統計分析（如平均值、趨勢圖、良率統計等），並製作簡易報表。
- 協助異常產品之初步處理與分析，包含資料整理、產品追蹤。
- 支援製程工程師進行實驗（DOE）或製程改善相關之資料準備工作。
- 協助維護製程文件、SOP 及相關記錄之更新。
- 其他主管交辦之製程支援事項。
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Frequently Asked Questions
Is the salary disclosed for the Wire Bond Process Assistant Engineer position at nxp?
The salary for this Wire Bond Process Assistant Engineer role at nxp is not publicly listed. Click "Apply Now" to learn more about the compensation package on their official careers page.
Where is the Wire Bond Process Assistant Engineer position at nxp located?
This Wire Bond Process Assistant Engineer role at nxp is based in Kaohsiung. The position is listed as on-site or hybrid. Check the full job description or apply directly to confirm the work arrangement.
Is the Wire Bond Process Assistant Engineer role at nxp full-time or part-time?
This is listed as a Full time position. It is posted as a Wire Bond Process Assistant Engineer role in the TW61 NXP Semiconductors Taiwan Ltd department at nxp.
Which team or department does the Wire Bond Process Assistant Engineer at nxp belong to?
This Wire Bond Process Assistant Engineer position is part of the TW61 NXP Semiconductors Taiwan Ltd department at nxp. See the full job description for more information about the team structure and responsibilities.
How do I apply for the Wire Bond Process Assistant Engineer position at nxp?
Click the "Apply Now" button on this page. You will be redirected to nxp's official application portal hosted on workday where you can submit your application directly.
Wire Bond Process Assistant Engineer
nxp
You'll be redirected to nxp's official application page on Workday.